3
3d integration K001
3d structuring 231
3d topography 224
A
acoustic 198, 238
acoustic impedance 238
acoustic microscopy 238
acoustical 198
activated 225
adaptive 216
adaptronics 216
air 257
aln 195
aln powder 195
alsi7 236
alternative 234
alumina 201, 247
alumina ceramics 247
aluminum 200
aluminum anodization 200
analysis 220, 236
angular resolver 245
anodization 200
application 230, 237, 243
approach 213, 226
aqueous 220
area 230, 260
array 200, 248, 249
aspect 227
assembly 225
assessment 247
asymmetric 207
automated 246
B
barium 205
batch 237
beam 200
bet method 195
bimodal 205
binding energy 195
bio-mems 250
biological 246
biomimetic 261
bipolar 260
bipolar plate 260
blanking 209
bonding 204, 208, 225
bottom 233
bottom gate 230
braille display 244
bulk metallic glass 223, 263
burrs 206
C
capacitors 205
carbon 212
carbon-nanotube-membranes 213
carbon nanotubes 213
cartridges 204
casting 220
catalyst 213
cell-holding 246
cell immobilization 246
cell microinjection 246
cells 213, 246
ceramic 201, 224, 231, 234, 247, 253, 258
ceramic green tape 231
ceramic tapes 224
ceramics 217
chain 205, 223
challenges 224
channel 196
characteristics 260
characterization 254
chemical 237
chip formation 240
cim 197
cnt 212
coated 209, 217
coating 260
coherence 247
combination 196, 198
comparison 213, 242
complex 196, 232
components 219, 251, 252
conducting 241
conductive 261
confocal white-light sensor 198
contactless 254
control 198
cooled 236
cop 204
copper 209
copper foil 209
copper powders 259
corresponding 212
corrosion 260
crystallisation 262
customized 221
cutting 199, 206, 236
cutting edge radius 199
D
delivery 208
demoulding 251
demoulding force 251
deposition 213, 252
design 214, 233, 243, 263
design optimization 233
desktop factory K003
development 205, 261
device 203, 208, 212, 219, 240, 244, 246
diamond 217
diamond coated 217
diatom 255
die-sinking 232
dielectric 195
dielectric substrates 195
directions 232
discharge 211
dispensing 214
disposable 214
distribution 236
dosage 248
drilling 258
drop 213
droplet 196
drug 208
drug delivery device 208
dry machining 236
duration/shape 258
dynamics 199
E
eco-machining 236
edge 199
edm 198, 232
edm-milling 198
effect 199, 211, 218, 260, 263, 258, 259
effects
ejection 251
elastomeric 251
elastomers 251
electrical 211
electrical discharge machining 198
electrode 211
electroformed 228
electroforming 215
electron 200
electron beam 225
electron beam lithography (ebl) 200
electronics 230
electrowetting 196
embedded 205, 247
embedded capacitors 205
embossing 203, 222, 253
embossing/punching 224
encoder 245
end 217
environmental 220
environmental impact 220
european 226, 261
ewod 196
F
fabrication 203, 210, 215, 222, 253
features 215, 223, 263
feedstocks 197, 202
fem simulations 233
femto second K002
fib 215, 225
filled 205
film 204, 239
finland K003
fixturing 216
flash 229
flexible circuit 203
flexible substrate 230
flexography 234
flow 257
fluidics 214
focused ion beam milling 223
foils 209, 222
force 251
forming 227
formulations 241
foundry K005
fp7 261
frame 261
framework K006
free 247
fresnel 229
fresnel lens 229
ft-ir spectra 195
ft-ir spectroscopy 195
fuel 213
fuel cell 207, 213, 241
function 250
function and length scale integration 223
functional 219
functional plastic 222
functionalized nanomembranes 261
future K006
future visions K003
G
gassing 257
glass 228
glass moulding 228
glasses K004
gradient 259
green 224, 231, 253, 258
grooved 233
H
hansen 208
hansen solubility parameters 208
hardened 206
hardened tool steel 206
high K004, 201, 227, 230, 243
high-k-ceramics 205
high-precision 209
high-tech 195
high-tech material for ic techniques 195
high aspect ratio 227
high volume nanoimprint 230
holes 211, 227
hollow microneedles 249
horizon-2020 K006
hot 203, 221, 222
hot-embossing 239
hot melt ink 221
human 248
hybrid 196, 198
hybrid machining 198
I
immobilisation 255
immobilization 246
implementation 223
induced 197
industrial practice K003
influence 199, 206
information and knowledge management 226
injection 197, 202, 210, 218, 248, 250, 263
injection molding 229
injection moulding 210, 248
injection moulding process 202
ink 221, 234
ink jet printing 221
innovation K006
insert 202, 249
integration 223
interactions 260
interconnect 244
interconnection 203
interface 248
interfacing 250
interference lithography 219
internally 236
investigations 260
ion beam 225
L
lab-on-a-chip 204, 252
lab-on-a-foil 204
large volume production K005
laser 249, 253, 258
laser-machined 247
laser ablation 198, 223
laser drilling 258
laser machining 247
laser milling 249
layer 213, 221
layer-by-layer 213
lbm 198
length 223
lens 229
life cycle assessment (lca) 220
light 229, 255
light scattering 247
lipss K002
liquid 214
lithography 200, 230, 239
local 252
localized 225
ltcc 201, 234, 253
M
machine 243
machine tools 243
machining 211, 236
manufacture 237
manufacturing K001, 202, 219, 239, 249, 255
mass 214
mass fabrication 214
master 215, 222, 223
material 195, 201, 243
maximum amplitude image 238
mechanical 254
melt 221
membrane 207
membrane-electrode assembly (mea) 261
membranes 200, 238, 241, 254, 261
meso 217
meso scale milling 217
metal 227, K004
metallic K004, 202, 260
method 212, 237, 254
micro 198, 199, 211, 215, 218, 219, 223, 232, 240, 263
micro-channel 236
micro-channeled 260
micro-edm 211, 242
micro-engineering 236
micro-injection 249, 257
micro-manufacturing 259
micro-milling 242
micro-nanomanufacturing 219
micro-nanostructures 219
micro-positioning 216
micro-scale 259
micro-stamping 260
micro-structured cavities 202
micro/nano 263
micro/nano features 263
micro blanking 209
micro cutting 199
micro edm milling 233
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micro electrical discharge machining (edm) 232
micro injection moulding 218, 249, 257, 263
micro manufacture 226
micro processing K002
micro replication 251
micro structures 210
microcutting 240
microelectronics 195
microfabrication 200
microfactory K003
microfluidic cell-holding device 246
microfluidics 196, 233, 250
microforming K004, 260
microhardness 259
microinjection 246
microinjection moulding 262
micromachining 198, 216, 222, 240
micromanufacturing 226
micromilling 206
micromixer 233
micromolding 229
micromoulding 262
microneedle 248
microneedles 249
microreactor 233
microscopy 238
microstructured 210
microsystems K001, K005, 250, 253
microthermoforming 204
mid 244
milling 217, 249
mills 217
miniature 245
miniaturization 245
mobile 229
modelling 226, 232, 236
mold flow analysis 229
molded 203
molded interconnect devices (mids) 203
molding 197
molecular 199
molecular dynamics 199
monitoring 212
monocrystalline 209
monocrystalline silicon 209
monomer 241
monte carlo method 247
mould 202
moulded 218, 244, 248, 250
moulded interconnect devices 244
moulding 202, 210, 228, 249, 257, 263
moulds 228
mounting 245
multifunctional 243
multifunctional materials 243
multilayer 201, 253
multilayer ceramics 253
multimaterial 226
multiplat 261
N
nafion 238
nafion membrane 238
nano 215, 223, 225, 237
nano-scale 262
nano-structured 219
nano manufacture 226
nano processing K002
nano safety 212
nano structures 237
nanochannels 261
nanocomposites 205
nanodevice 212
nanofabrication 219
nanofiber 212
nanoimprint 230, 239
nanoimprint lithography 230
nanomembranes 254
nanopore 200
nanoporous 241
nanoporous membranes 219
nanosphere 200
nanosphere lithography (nsl) 200
nanotubes 212
nd:yag 198
new 223, 240
ni-shim 215
nickel 228
nil 239
novel 216
nutrients 255
O
objects 225
on-machine measurement 198
operations 242
opportunities 224
optical 198, 245, 247
optical coherence tomography (oct) 247
optimal 229
optimization 233, 234
optimized 214
organic 230, 239
organic transistor 239
orientation 255
orthogonal 240
orthogonal cutting 240
overview 254
P
package 250
parameters 206, 208, 211, 218
parts 210, 216, 218
patterned 200
patterning surfaces K002
peek 245
pem fuel cell 260
pemfc 260
personal 212
personal sampler 212
phase-sensitive 238
phone 229
photopolymerizable 241
physico-chemical 195
pico second K002, 198
piercing 227
pim 197
plasma 252
plasma treatment 252
plastic 219, K004, 210
plates 260
poc 196
poc-devices 196
polyimide 222
polymer 218, 250, 252
polymer-based 205
polymer-ceramic-composites 205
polymer electrolyte 207, 241
porosity 259
porous 259
porous surfaces 259
potential 247, 257
powder 195, 197
powder injection molding 197
precise 216
precision 228, 243
prediction 251
print 234
printed circuit board 221
printing 221, 239
process 198, 202, 205, 211, 218, 223, 227, 263
process chain 215, 223, 226
process monitoring 257
process parameter 211, 218
process planning 242
processes 222
processing 237
producing 223
production 201, 214, 244
production platform K005
profilometry 234
programme K006
project 261
properties 254
protective 221
protective layers 221
proton 241, 261
proton-conducting 207
proton conductive wires 261
proton exchange membrane 207, 241
proton exchange membranes fuel cells (pemfc) 261
prototypes 244
pulse 258
pulse duration 258
pulse shape 258
pulsed 198
punches 209
punching 224, 253
Q
quality 217, 218, 220, 260
quick-stop 240
quick-stop device 240
R
radius 199
raman-spectroscopy 212
ratio 227
reading 212
real time embedded system 246
realising 262
realization 205
reduced puncture force 248
reflow 245
reflow soldering 245
replication 202, 215, 223, 263
replication quality 263
research K006, 232
resistance 260
rfid 203
rheology 202
roll-to-roll 239
rolling 201
room 224
room temperature embossing 224
rotary 222
rotary hot embossing 222
roughness 206, 247
S
sampler 212
scale 217, 223, 225, 263
sealing 204, 250
sealing gasket 250
self-alignment 250
self assembly 219
series 244
shape 211
shaving 227
sheet 201, 211, 227
sheet materials 201
sheet metal 227
si3n4 coating 209
silica 201
silicon 209, 219, 250
silicon packaging 250
simulation 199
sintering 259
size 199
size effect 199
small 244
small series production K005, 244
smart 236
smart actuators 216
smart tooling design and analysis 236
sol-gel 207
solder 245
solid-state 200
solid-state nanopore array membranes 200
solubility 208
solvent 208
solvent bonding 208
specific surface area 195
spectroscopic 195
steel 249
steels 206
strength K004
structured 202, 262
structures 237
structuring 231, 232, 253
structuring of polymers 222
study 195, 206, 227, 251
substrates 195, 234
suitability 228
surface 217, 225, 237, 260
surface activation 225
surface quality 217
surface roughness 247
surface structuring 224, 262
surfaces 247, 259, 262
sustainable machining 236
system 214, 248
T
tape 220, 253, 224, 231, 258
tape structuring 253
technique 239
technological interfaces 226
technologies 226
technology 203, 221, 253, 258
technology maturity 226
tem micrographs 195
temperature 224, 236, 259
thick 201
thick tapes 201
thin 204, 209, 213, 216, 239
thin film 252
titanate 205
titanium 211
tomography 247
tool 215, 236, 247, 243
tool life 197
tool manufacture 215
tool production 209
tool wear 206
tooling 228, 237
towards 226, 239
tpe 250
transistors 239
tribology 260
tut microfactory K003
U
ultra 243
ultra high precision machining 243
ultra short laser pulses K002
ultrasonic 203
ultrasonic hot embossing 203
uncoated 209
uv 198
uv-curable 231
uv-curing 231
uv-laser 198
uv-nil 215, 230
V
variothermal process control 210
vascular 248
vascular system 248
viscosity 234
viscosity range 214
volume 201, 230
W
wafer 228
walled 204, 216
water-based tape casting 220
water-immersed 238
way 234
wear 232
wear-effects 197
wear of mold-inserts 197
workplace safety 212
X
xps 195
xrd analysis 195
Y
young’s modulus 238, 254
Z
zirconia 197, 201
zro2 217
zro2 - feedstock 197
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