Copyright

Published by
RESEARCH PUBLISHING
No:83 Genting Lane, #08-01 Genting Building, 349568 SINGAPORE.
e-mail: editorial@rpsonline.com.sg

India Office: New No: 61/1 First Cross Street, CIT Nagar, Chennai 600035.

Proceedings of the 8th International Conference on
Multi-Material Micro Manufacture

Editors: Heinz Kück, Holger Reinecke and Stefan Dimov

ISBN-13: 978-981-07-0320-2
ISBN-10: 981-07-0320-1

This CD-ROM, or parts thereof, may not be reproduced in any form or by any means, electronic or mechanical, including photocopying, recording or any information storage and retrieval system now known or to be invented, without written permission from the 4M 2011 Organisers or the Publisher.

Disclaimer:

No responsibility is assumed by the 4M 2011 Organisers/Publisher for any injury and/or damage to persons or property as a matter of products liability, negligence or otherwise, or from any use or operation of any methods, products or ideas contained in the material herein. Contents, used in the papers are how it is submitted and approved by the contributors after minor changes in the formatting. Whilst every attempt made to ensure that all aspects of the papers are uniform in style, the 4M 2011 Organisers, Publisher or the Editor(s) will not be responsible whatsoever for the accuracy, correctness or representations of any statements or documents presented in the papers.

The image used in the home and in the banner, of a draft structure for a new type of moulded interconnect device, produced by hot melt printing on copper foil, is reproduced by kind permission of the Hahn-Schickard-Institute for Micro Assembly Technology (HSG-IMAT), Stuttgart, Germany.