Injection Moulded Polymer Package for Silicon Microsystems with Self-Alignment Function

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doi:10.3850/978-981-07-0319-6_250

Injection Moulded Polymer Package for Silicon Microsystems with Self-Alignment Function

Naegele Lars¹, Reinecke Holger^1,2 and Schoth Andreas¹

¹University of Freiburg, Department of Microsystems Engineering – IMTEK, 79110, Freiburg, Germany

²HSG-IMIT, Institut für Mikro- Und Informationstechnik der Hahn-Schickard-Gesellschaft, 78052, Villingen-Germany

ABSTRACT

This work presents a novel packaging principle for silicon bio-MEMS, enabling precision alignment within only a few microns. Based on injection moulded polymer components, a proof of concept is presented, featuring integrated microfluidic routing, sealing and biological barrier functions. The system is designed for usage in pick-and-place assembly lines as well as to enable laser welding.

Keywords: Silicon packaging, Bio-MEMS, Polymer, TPE, Interfacing, Microfluidics, Sealing, Sealing gasket.

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Injection Moulded Polymer Package for Silicon Microsystems with Self-Alignment Function

Naegele Lars1, Reinecke Holger1,2 and Schoth Andreas1

1University of Freiburg, Department of Microsystems Engineering – IMTEK, 79110, Freiburg, Germany

2HSG-IMIT, Institut für Mikro- Und Informationstechnik der Hahn-Schickard-Gesellschaft, 78052, Villingen-Germany

ABSTRACT

Naegele Lars¹, Reinecke Holger^1,2 and Schoth Andreas¹

¹University of Freiburg, Department of Microsystems Engineering – IMTEK, 79110, Freiburg, Germany

²HSG-IMIT, Institut für Mikro- Und Informationstechnik der Hahn-Schickard-Gesellschaft, 78052, Villingen-Germany