doi:10.3850/978-981-07-0319-6_203


RFID Fabrication by Ultrasonic Hot Embossing of Devices Molded Interconnection Technology


D. Ulieru, A. Tantau and Elena Ulieru

SITEX 45 SRL, 114, Ghica Tei Blvd Bl40, Ap2 Department 2 Bucharest, Romania

ABSTRACT

Ultrasonic hot embossing allows fabrication of metal patterns onto a polymer film with a low cost and rapid process. A polymer layer with a thin metal film on top is welded onto the polymer substrate where there are protruding micro structures on the tool. Edges around the protruding structures cut the metal layer and ensure electrical insulation. The entire process performs in a few seconds. The non-welded areas are mechanically removed after this process. Advances in micro-and nanotechnology and in new materials, software and communications technology have moved the technical vision of the “Internet of Things” into the realm of the possible. RFID is a key component in this process, providing the linkage between the “world of production” (represented by the material good) and the “world of service” (represented by digitalized information). With RFID tags, objects become “smart” and can be networked together and communicate with their environment. RFID technology as a precursor to the Internet of Things will optimize existing processes in various industrial sectors. An antenna of a radio frequency identification device (RFID) and a flexible membrane keyboard were fabricated by embossing 10 µm-thick conductive paths from an aluminum foil onto polypropylene films, 150 and 250 µm in thickness. Antenna circuits have been proven to show the expected resonance frequencies and the keyboard was successfully employed as an input device for a PC.

Keywords: RFID, Flexible circuit, Molded Interconnect Devices (MIDs), Ultrasonic hot embossing.


     Back to TOC

FULL TEXT(PDF)