doi:10.3850/978-981-07-0319-6_208


Solvent Bonding of a Drug Delivery Device by Using Hansen Solubility Parameters


S. Herrlich, T. Lorenz, S. Spieth, S. Messner and R. Zengerle

Institut Für Mikro-Und Informationstechnik Der Hahn-Schickard-Gesellschaft e.V. (HSG-IMIT), 78052, Villingen-Schwenningen, Germany

ABSTRACT

A parameter based approach for selecting hybrid thermoplastic material combinations for solvent bonding by applying the supposed Hansen Solubility Parameter (HSP) model is demonstrated. This new method allows identification of (i) appropriate material combinations as well as (ii) less harmful or more cost effective solvents to replace potentially toxic combinations. The required number of experimental trials is minimized with respect to conventional selection techniques in both cases. Exemplary, the HSP model was successfully applied to select the polymer material of a flexible membrane as well as a suitable solvent mixture for bonding with a rigid cyclic olefin copolymer (COC). The rigid/flexible material bond is the integral part of a miniaturized microfluidic drug delivery device based on osmotic pumping. Characterizations of the bond quality in the assembled device confirmed the predictions of the model as a promising engineering tool.

Keywords: Solvent bonding, Hansen solubility parameters, Drug delivery device.


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