doi:10.3850/978-981-07-0319-6_253

ABSTRACT

Multilayer ceramics technology, such as Low Temperature Co-fired Ceramics (LTCC), is succesfully applied to build up electronic multilayer assemblies of high reliability and excellent RF performance. However, it offers distinctive advantages for the realization of miniaturized three-dimensional structures as well. The chemical inertness and mechanical stability of the ceramic material, combined with the possibility to realize electrical, mechanical and fluidic functions within the same technology, make it ideally suited for the fabrication of microsystems. The respective structuring of green sheets and laminates is accomplished by either mechanical or laser machining methods. The present paper discusses requirements on the structuring process as well as the applicability of the different methods. Characteristic results, which are achieved with mechanical and laser based tape structuring methods, are presented.

Keywords: Multilayer ceramics, LTCC, Tape structuring, Punching, Embossing, Laser.

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