ABSTRACT
The European MULTILAYER project ambitions to develop a new platform for the large-scale production of micro devices based on a technology called “Rolled multi material layered 3D shaping technology” and using the concept of tape casting, surface structuring and advanced printing techniques. This technology will enable the high-throughput manufacturing of complex 3D-micro parts while using a layer-by-layer approach. Each layer can be given a specific structure. They will be printed and contain channels and cavities that are open or filled in a very high precision manner. The micro device will have as basic building material ceramics, which is a clear advantage in applications that require high temperature, aggressive environments, particular dielectric material, low thermal conductivity and long time reliability. Furthermore, it will allow details on it with spatial resolutions under 10 μm.
Therefore, the aim of this paper is to describe the recent solutions developed at CEA for performing room temperature embossing and punching. For this purpose alumina, silica and zirconia tapes, developed within the consortium, were used. A first room temperature embossing device will be here presented. Preliminary experiments with systematic basic tests have been carried out in order to determine a functional concept of room temperature embossing/punching process. The main conditions have included the tool motion and structure, the embossing temperature, the applied pressure, and the intrinsic parameters of the used green tapes. A peculiar attention has been paid on the processing time that has to be shortening as possible.
Keywords: Surface structuring, Room temperature embossing, Punching, Ceramic tapes, 3D topography.
