doi:10.3850/978-981-07-0319-6_225

ABSTRACT

A new bonding technique for micro and nano scale applications in handling and assembly tasks is presented in this work. The intended scale corresponds approximately to that of particle beam based deposition techniques like electron or ion beam induced deposition (EBiD/IBiD). Basically, the presented process is scaled down from wafer scale surface activated bonding (SAB) processes, where large surfaces are bonded by chemical activation due to argon sputtering. By using a scanned focused ion beam (FIB) for the activation process, bonding surfaces in arbitrary geometries on a scale in the nanometre region are possible. Due to the absence of additional precursor gases or other external bonding materials the surface activated bonding method is advantageous compared to EBiD and IBiD because of the avoided problem of contamination in the surroundings of the bond. Additionally, the localized SAB process is much faster than EBiD or IBiD.

Keywords: Nano, Bonding, Surface activation, FIB, Ion beam, Electron beam, Assembly.

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