
| RFID Fabrication by Ultrasonic Hot Embossing of Devices Molded Interconnection Technology D. Ulieru, A. Tantau and Elena Ulieru |

| Solvent Bonding of a Drug Delivery Device by Using Hansen Solubility Parameters S. Herrlich, T. Lorenz, S. Spieth, S. Messner and R. Zengerle |

| Fabrication of Micro-Structured 3D Plastics Parts by Injection Moulding Walter Michaeli, Christian Hopmann, Maximilian Schöngart, Arnold Gillner and Claudia Hartmann |

| Liquid Dispensing System with Optimized Design for Mass Production F. Wolter, K. -P. Fritz and H. Kück |

| Micromachining of Polyimide Foils for the Fabrication of Embossing Masters for Rotary Hot Embossing Processes D. Nußbaum, T. Knoll and T. Velten |

| Localized Surface Activated Bonding of Nano Scale Objects T. Luttermann, T. Wich and M. Mikczinski |

| Injection Moulded Microneedle Arrays as an Interface to the Human Vascular System T. Botzelmann, V. Mayer, M. Vosseler, S. Spieth and H. Kück |

| A Study of Demoulding Force Prediction for Elastomeric Components K. D. Delaney, G. Bissacco and D. Kennedy |

| Effect of Design on the Replication of Micro/Nano Scale Features in the Micro Injection Moulding Process N. Zhang, D. J. Browne and M. D. Gilchrist |

| Small Series Production of Moulded Interconnect Devices (MID) U. Keßler, W. Eberhardt, A. Fischer, S. Weser, H. Willeck and H. Kück |