| RFID Fabrication by Ultrasonic Hot Embossing of Devices Molded Interconnection Technology
D. Ulieru, A. Tantau and Elena Ulieru |
| Solvent Bonding of a Drug Delivery Device by Using Hansen Solubility Parameters
S. Herrlich, T. Lorenz, S. Spieth, S. Messner and R. Zengerle |
| Fabrication of Micro-Structured 3D Plastics Parts by Injection Moulding
Walter Michaeli, Christian Hopmann, Maximilian Schöngart, Arnold Gillner and Claudia Hartmann |
| Liquid Dispensing System with Optimized Design for Mass Production
F. Wolter, K. -P. Fritz and H. Kück |
| Micromachining of Polyimide Foils for the Fabrication of Embossing Masters for Rotary Hot Embossing Processes
D. Nußbaum, T. Knoll and T. Velten |
| Localized Surface Activated Bonding of Nano Scale Objects
T. Luttermann, T. Wich and M. Mikczinski |
| Injection Moulded Microneedle Arrays as an Interface to the Human Vascular System
T. Botzelmann, V. Mayer, M. Vosseler, S. Spieth and H. Kück |
| A Study of Demoulding Force Prediction for Elastomeric Components
K. D. Delaney, G. Bissacco and D. Kennedy |
| Effect of Design on the Replication of Micro/Nano Scale Features in the Micro Injection Moulding Process
N. Zhang, D. J. Browne and M. D. Gilchrist |
| Small Series Production of Moulded Interconnect Devices (MID)
U. Keßler, W. Eberhardt, A. Fischer, S. Weser, H. Willeck and H. Kück |