Others
µ-Structuring 356
3D-printing 359
4M2020 4M2020ot
A
Accuracy 354, 355
Acrylate based ink 343
Additive manufacturing (AM) 346, 359, 407
AFM probe-based machining 423
Amorphous hydrogenated carbon 336
Antireflective properties 368
B
Biological cell-growth 367
Bit patterned media 442
Building integrated PV 410
Bulk metallic glasses 341
C
Carbon foam 332
Cell adhesion 417
Ceramic 413
Charge/discharge cycle 332
Chip formation 358
CIM 412
CMOS technology microelectronics special
devices 337
Colloidal crystal 368
Compression injection moulding 371
COMSOL 368
Cooling 426
Copper bonding challenges 345
Copper wire 345
Copper wire cost benefits 345
Copper wire in production 345
Co-simulation 351
COTECH COTECH
Crater 414
CSA Project 4M2020ot
Custom designed solar modules 410
Cutting edge displacement 418
Cutting forces 358
D
Defects 432
Demoulding 336, 353
Design methods 347
Design optimization 347
Design rules 424
Diamond like carbon 336
Discharge inductance 357
Discharge resistance 357
Displacement 421
DLC 340
DLC coating 338
DoE 356
D-shaped electrodes 342
Dynamic mould heating 365
E
EDM 356, 416, 417
Ejection dynamics 420
Electrical discharge 357
Electrically-assisted microrolling 372
Energy consumption 415
Error 354
Experimental measurements 415
Expert system 424
Extrusion based 3D printing 359
Extrusion embossing 441
F
Failure analysis 428
Feedstock development 335
FIB-CVD 442
Finite element simulation 333
Flexible PV modules 410
Flexible scalable manufacturing 407
Focused ion beam milling 341
Fourier transform 364
FP7 4M2020ot
Fresnel lens array 339
Fuel cell 340
Function and length scale integration 341
Functional ink 343
G
Glassy alloy 442
Gold wire replacement 345
H
Heat affected zone 349
Hexagonal closed packed 368
High aspect ratio 344
High dynamic range 432
Hot embossing 367
Hydrogen gas permeability 340
Hysteresis 421
I
IMPRESS IMPRESS
Infrared camera 375
Infrared thermography 428
Injection moulding 365, 367, 419, 441
Ink-jet 422
Inkjet printing 343
In-line 419
Integration 347
Intermediary support 348
Intermetallic (Cu-Sn) nanoparticles 332
Iron oxide nanoparticles 343
L
Lab-on-a-chip 419
Laser ablation 365
Laser based patterning process 413
Laser induced forward transfer 420
Laser machining 366
Laser material processing 349
Laser micro machining 355
Laser micro-forming 438
Laser trimming 337
Li-ion batteries 332
Liquid membrane ECM 344
Liquid silicone rubber 441
LPKF-LDS® 413
M
Masking 338
Mechatronic clamping system 418
Melt viscosity 371
MEMS 351, 421
Meshing 426
Mesoscale manufacturing 363
Mesoscopic alignment 340
Metallic glass 442
Micro and nano features 424
Microblanking 333
Micro ceramic injection moulding 335
Micro-EDM milling 411
Micro-electrical discharge machining
(Micro-EDM) 342, 357, 414, 415
Micro-fixturing 363
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Microfluidics 336
Micro forming 338
Micro injection moulding 346, 341, 353, 375,
416, 417, 426
Micro machining 354, 358, 416
Micromanipulator 363
Micromanufacturing 363
Micro milling 354, 416, 418
Micromixer 416
Micro needles 346, 371
Micro parts 441
Micro porosity 370
Microrolling 372
Micro structures 365
Microsystems shaping and adjustment 438
MIM 412
Modeling and simulations of MEMS/NEMS 351
Modelling 368
Modelling and characterization 337
Modelling approach 424
Monocrystalline silicon 333
Moulded Interconnect Devices (MID) 413
Multi-functional Products 4M2020ot
Multi-material 4M2020ot
N
Nano die 442
Nanoimprint 442
Nano-lamination 340
Nano-picosecond laser pulses 420
Nano-second laser 366
Nanosecond laser machining 404
Nanosphere lithography 367
NEMS 351
Non-conductive ceramic 356
NURBS surface deformation 414
O
Offset diamond turning 339
Optical element 364
P
Parsimo 347
PDMS 421
Penetration 346
Phase-change actuators 421
Photopolymerization 422
Pilot line 422
Plasma etching 338
Plasma treatment 419
Polycarbonate 371
Polymer 350, 417
Polymer cooling 375
Porous nanocomposite electrodes 332
Powder injection moulding 412
Precision metrology 354, 355
Printing technologies 407
Process chains 341
Process control 371
Process monitoring 353
Process stability 371
Product development 351
Product engineering 351
Product integrated PV 410
Product quality 371
Production platforms 422
PS laser ablation 341
Pulse characterization 411
Pulse discrimination 411
PVD-coating 365
Q
Quality control 428
R
Rapid prototyping (RP) 346, 351
Regional development 348
Replication 371
Resolution 346
Rheology 350
RIE 442
Roll embossing 350
Roll-to-roll 422, 432
Roughness surfaces 350
S
Self-assembly 422
Sensors 351
Shock forming 438
Short pulse lasers 438
SiC 356
SIESTA 347
Simulation 414, 426
Single pulse processing 404
SiP 347
Smart manufacturing 407
SOFC 370
Soft tooling 346
Solid oxide fuel cells 370
Solvent based sol-gel ink 343
Specific capacity 332
Spin offs 348
Spot soldering process 428
Stereolithography (SLA) 346
Straight reciprocating motion 344
Sub-micrometre tool 344
Superhydrophobicity 367
Surface engineering 338
Surface roughness 417
Surface roughness modelling 423
Surface structuring 336
Surface texturing 368
Surface topography 432
T
Texturing 372
Thermal contact resistance 375
Thermoset 413
Thin coating 419
Thin layers 370
Time resolved imaging 420
Tolerances 412
Tool and dies 338
Tool load 333
Tool wear 411
Transnational R&D projects 348
U
Ultra precision machining 339, 364
Ultrashort pulse laser 413
Uncertainty 355
V
Venting 426
Verification test 354, 355
Virtual manufacturing 351
W
Water absorption 371
Water based tape casting 370
Water-soluble binders 335
Wear 414
Z
Zr-based bulk metallic glass 366, 404
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