Proceedings of the
9th International Conference of Nanomanufacturing (nanoMan2024)
December 1 – 4, 2024, Singapore
Characterization and Enhancement of a Multi-Layer Diamond Tool for Self-Sensing of Cutting Temperature
The State Key Lab of Fluid Power and Mechatronic Systems, Zhejiang University, Hangzhou, China.
ABSTRACT
The high-sensitivity and accurate monitoring of micro-zone cutting temperature is crucial for the characterization and optimization of the machining states in ultra-precision cutting process. Using the cutting tools itself as cutting temperature sensors is an innovative method for in-process measurement of cutting temperature. In this work, optimized synthesis process for a multi-layer diamond tool functional of temperature-sensing were proposed. The annealing treatment under high pressure conditions were conducted to promote the diffusion and ionization of boron multimers in the boron-doped diamond zone of the multi-layer diamond, thereby enhancing the crystal quality and semiconductor electrical properties. The improved multilayer diamond after grinding, as the temperature-sensing cutting tool, was employed for in-process cutting temperature measurement in single-point diamond turning of silicon at different cutting parameters. Results indicate that the capability of the multi-layer diamond tool to in-process accurately monitor cutting temperature during steady cutting process. These insights are pivotal for controlling cutting temperature and refining the ultra-precision cutting process.
Keywords: Cutting temperature monitoring, Self-sensing diamond tool, Ultra-precision machining.
