Proceedings of the
9th International Conference of Nanomanufacturing (nanoMan2024)
December 1 – 4, 2024, Singapore
Molecular Dynamics Simulation of Tool Wear in Elliptical Vibration Cutting: Case Study on 3C-SiC
State Key Laboratory of Ultra-precision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong.
2State Key Laboratory of Intelligent Manufacturing Equipment and Technology, School of Mechanical Science & Engineering, Huazhong University of Science and Technology, Wuhan, China
ABSTRACT
For the last few decades, elliptical vibration cutting (EVC) has been successfully applied in machining of many difficult-to-cut materials. During the machining process, the cutting tool usually vibrates in a high frequency and the transient material removal thickness ranges from a sub-nanometer level to a few nanometers. The interaction mechanism between cutting tool and workpiece is complicated and an in-deep understanding of the tool wear mechanism during EVC is required. In this research, molecular dynamics (MD) simulation was conducted to investigate the tool wear mechanism during EVC of monocrystalline 3C-SiC. Based on the proposed MD model, the tool vibration amplitude and nominal depth of cut in the simulation model is remarkably increased to describe the transient material removal feature in a single vibration cycle. The results indicates that during EVC, wear in the bottom of the tool edge mainly occurs in the initial stage of the vibration cycle while wear near the tool rake face can be observed in the extrusion-shear stage. According to the stress analysis, the tool rake face experiences obvious tensile stress in the extrusion-shear stage. The shape of the cutting tool is changed and compression of the material is observed with the propagation of crack, which can be identified as microchipping of the cutting tool. The results in this research could open a potential to improve the understanding in diamond tool wear mechanism during EVC.
Keywords: Molecular dynamics simulation, Elliptical vibration cutting, Silicon carbide, Tool wear.
