Invited Talks

Thin Film Organic Devices as a platform for Roll to Roll Production of Sensor Systems
Herman Schoo, TNO, The Netherlands

Complex Tooling for Hot Embossing and Injection Molding
Alexander Stuck, CSEM, Switzerland

Process Structuring of Polymers and Polymer Nanocomposites in Micromoulding
Phil Coates, Bradford University, UK

Development of a New Micro-machining Technique and its Eco-efficiency Evaluation
Nozomu Mishima, AIST, Japan

Potential of Moulded Interconnect Devices for the Packaging of Miniature Multifunctional Systems
Heinz Kück, HSG-IMAT, Germany

Continuous Polymer Nanolayer Processing by Forced Assembly
Eric Baer, Case Western Reserve University, USA