doi:10.3850/978-981-08-6555-9_177

ABSTRACT

Integration of multiple functions in single components is pursued in order to manufacture at less cost smaller and smarter polymer micro devices. A method to achieve this is surface activation, i.e. fully or patterned changing of the surface properties. Examples are moulded interconnect devices with conductive surface tracks and lab-on-chip devices with locally adapted wetting properties. The supply chain of such parts is often vulnerable, resulting in concerns on reliability of production and product. A solution is integration of processes in one production cell. This paper addresses two innovations: in-mould plating and in-mould plasma treatment. I.e. the integration of plating and plasma based patterning processes into an injection mould.

Keywords: Injection moulding, Plating, Plasma treatment.

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