doi:10.3850/978-981-08-6555-9_173

ABSTRACT

Abrasive waterjet (AWJ) cutting has been evaluated for micro cutting of alumina and single crystal as silicon and sapphire. The cutting beam diameter is today 200 µm and it is possible to cut parts down to 100-200 µm. The cutting accuracy, precision, taper angle and circularity have been evaluated for different hole diameters between 400 µm and 2000 µm at different feed rates. Circular discs were cut out from alumina, single crystal silicon and sapphire. The best edge definition was obtained on the alumina discs, while on the silicon and sapphire samples small flakes were cut out from the edge. Due to discoloration and thus contamination of metallic compounds from traditional garnet abrasive an alternative abrasive media was used.

Keywords: Micro structures, Fine abrasive waterjet, Single crystal silicone, Sapphire.

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