doi:10.3850/978-981-08-6555-9_167

ABSTRACT

Hot embossing is a fast and economic process for manufacturing of Molded Interconnect Devices (MID). The layout of an electronic circuit is punched out with a hot embossing stamp and pressed simultaneously on a thermoplastic substrate. Today hot embossing MID technology is used for many applications like car electronics, switches and medical equipment. However increasing requirements like higher thermal stress or ongoing miniaturization as well as permanent cost pressure ask for further development.

Within this paper new developments in hot embossing MID-technology are reported. This concerns enhanced process equipment and new materials used for the hot embossing process. Hot embossing stamps with hard coatings lead to higher lifetime cycles of the stamps. Rolled copper foils pre-cut with a laser increase lifetime of the stamps as well and enable manufacturing of fine lines and spaces not possible with electro deposited (ED) foils. Finally both approaches can lead to cost reduction in hot embossing MID production.

Keywords: Hot embossing technology, MID, ED copper foils, Rolled copper foils, Hard coatings, DLC, Laser cutting.

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