doi:10.3850/978-981-08-6555-9_153

ABSTRACT

3D MID technology (Moulded Interconnect Devices) has become state of the art for products with a high demand for miniaturization and integration of additional functionality. Miscellaneous MID technologies offer solutions for a variety of applications with individual requirements. Regarding that MID are usually part of complex hybrid systems, special attention has to be paid towards internal and external connection techniques. On the one hand MID carry electronic components like SMD or even bare dies as well as they can include sensor elements or fluidic structures. On the other hand they are part of a complex electronic system and have to be connected to peripheral elements like e.g. PCB. Therefore different joining techniques are used depending on the individual requirements. Usually well known techniques for PCB and chip-packaging are used, but usually those techniques have to be adapted for MID. Thermoplastic materials, three-dimensional geometry, properties of the metal layers usually require process optimization. Within this paper different techniques for both internal and external connections of 3D-MID are reported. This includes SMD assembly, flip chip and wirebonding, connections with PCB or external wiring by means of press-fit interconnections, soldering or resistance welding. Different processes are investigated and evaluated on their suitability for MID.

Keywords: MID, SMD, Bare dies, Joining techniques, Assembly, Press-fit, Micro resistance welding.

© 2011 4M 2010 Organisers