Committees
Organising Committee
Conference Chair |
V. Saile, Forschungszentrum Karlsruhe, Germany |
Conference Co-chair |
S. Dimov, Cardiff University, UK |
L. Mattsson, KTH, Sweden
E. Jung, The Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany
U. Engel, University of Erlangen-Nuremberg, Germany
P. Johander, Swerea IVF, Sweden
C. Wenzel, Fraunhofer Institute of Production Technology, Aachen, Germany
M. Richter, The Fraunhofer Institute for Reliability and Microintegration, Munich, Germany
P. Kirby, Cranfield University , UK
A. Schoth, IMTEK, University of Freiburg, Germany
S. Anson, Forschungszentrum Karlsruhe, Germany
M. Kautt, Forschungszentrum Karlsruhe, Germany
C. Matthews, Cardiff University, UK
Programme Committee
Conference Chair |
Volker Saile, FZK, Germany |
Conference Co-chair |
Kornel Ehmann, Northwestern University , USA |
Sabino Azcarate, TEKNIKER, Spain
Donna Bibber, Micro Engineering Solutions, USA
Marc Bonis, UNIVERSITY Tech. de Compiegne, France
Matt Bono, Lawrence Livermore Nat. Lab. , USA
David Burton, Performance Micro Tool, USA
Jian Cao, Northwestern University, USA
Dong-Woo Cho, Postech, Korea
Martin Culpepper, MIT, USA
Richard DeVor, UIUC, USA
Dimitri Dimitrov, Stellenbosch University, South Africa
Kuniaki Dohda, Nagoya Inst. Tech., Japan
Alkan Donmez, NIST, USA
Ulf Engel, University of Erlangen-Nuremberg, Germany
Sergej Fatikow, University of Oldenburg, Germany
Luc Federzoni, CEA, France
Bertrand Fillon, CEA, France
Volker Schulze, University of Karlsruhe, Germany
Michael Fu, MIRDC, Taiwan
Hans Nørgaard Hansen, DTU, Denmark
Ralph Hollis, Carnegie Mellon University , USA
Andrew Honegger, Microlution, USA
Yong Huang, Clemson, USA
Per Johander, Sverea IVF AB, Sweden
Suhas Joshi, IIT, Bombay
Martin Jun, University of Victoria, Canada
Erik Jung, FhG IZM-Berlin, Germany
Shiv Kapoor, UIUC, USA
Matthias Kautt, FZK, Germany
Brad Kinsey, University of New Hampshire, USA
Paul Kirby, University of Cranfield, UK
Muammer Koc, Virginia Commonwealth U., USA
Senthil Kumar, NUS, Singapore
Thomas Kurfess, Clemson University , USA
Richard Leach, NPL, UK
Steven Liang, Georgia Inst. Tech. , USA
Y.S. Liao, Nat. Taiwan University, Taiwan
Kui Liu, SIMTech, Singapore
Marc Madou, University California-Irvine, USA
Ajay Malshe, University of Arkansas, USA
Lars Mattsson, KTH, Sweden
Rhett Mayor, Georgia Inst. Tech. , USA
Shreyes Melkote, Georgia Inst. of Tech. , USA
Wolfgang Menz, University of Freiburg, Germany
Nagahanumaiah, CMERI, India
Bradley Nelson, ETH Zurich, Switzerland
Gracious Ngaile, North Carolina State University , USA
Jun Ni, University of Michigan, USA
Humbert Noll, FOTEC, Austria
Yuichi Okazaki, AIST, Japan
Bill O’Neill, Cambridge University, UK
Burak Ozdoganlar, Carnegie Mellon, USA
Tugrul Ozel, Rutgers University , USA
Jong-Kweon Park, KIMM, S. Korea
Simon Park, University of Calgary, Canada
Frank Pfefferkorn, University of Wisconsin, USA
Jon Pratt, NIST, USA
Mustafizur Rahman, NUS, Singapore
K.P. Rajurkar, University of Nebraska, USA
Svetan Ratchev, Nottingham University, UK
Venkata Reddy, IIT-Kanpur, India
Ralph Resnick, Ex-One, USA
Martin Richter, FhG IZM-Munich, Germany
Andreas Schoth, University of Freiburg , Germany
Yung Shin, Purdue University, USA
Reijo Tuokko, Tampere University, Finland
R. Vallance, George Washington University, USA
Michael Vellekoop, Vienna University of Technology, Austria
Shihming Wang, CYCU, Taiwan
Paul Warndorf, AMT, USA
Christian Wenzel, FhG IPT, Germany
Gloria Wiens, University of Florida, USA
Chad O’Nea, Micromanufacturing Institute Louisiana Technical University, USA