Proceedings of the
World Congress on Micro and Nano Manufacturing (WCMNM 2022 )
19-22 September 2022, Lueven, Belgium
doi:10.3850/978-981-18-5180-3_RP60-0001
Micro-Textured Graphitic Substrate – Copper Packaging for Robustness
1Surface Engineering Design Laboratory, SIT, Japan
2Ebina Denka-Kogyo, Co., Ltd., Japan
3Thermo-Graphitics, Co., Ltd., Japan
ABSTRACT
The graphene block had the highest thermal conductance but very low toughness. The copper base packaging was essential to use the brittle graphene solid as a heat spreader and to sustain the reliable integrity even under the severe thermal transient conditions. Instead of the conventional approaches to wrap and cover the graphene block by copper layers, a new packaging method was proposed to build up micro-grooves onto either graphene block surface by using the plasma printing and to construct the three-dimensional copper coverage. The thermal transient testing was utilized to describe the damage behavior of traditional and new packages under heat transients and to demonstrate the improvement of robustness and toughness by new packaging.
Keywords: Graphene Block, Copper Packaging, Micro-Grooving, Thermal Transients, Robustness, Heat Spreading.
1Surface Engineering Design Laboratory, SIT, Japan
2Ebina Denka-Kogyo, Co., Ltd., Japan
3Thermo-Graphitics, Co., Ltd., Japan
ABSTRACT
The graphene block had the highest thermal conductance but very low toughness. The copper base packaging was essential to use the brittle graphene solid as a heat spreader and to sustain the reliable integrity even under the severe thermal transient conditions. Instead of the conventional approaches to wrap and cover the graphene block by copper layers, a new packaging method was proposed to build up micro-grooves onto either graphene block surface by using the plasma printing and to construct the three-dimensional copper coverage. The thermal transient testing was utilized to describe the damage behavior of traditional and new packages under heat transients and to demonstrate the improvement of robustness and toughness by new packaging.
Keywords: Graphene Block, Copper Packaging, Micro-Grooving, Thermal Transients, Robustness, Heat Spreading.
