Proceedings of the
World Congress on Micro and Nano Manufacturing (WCMNM 2022 )
19–22 September 2022, Lueven, Belgium
doi:10.3850/978-981-18-5180-3_RP57-0003
Manufacturing and Characterization of Acicular Fe-Ni Micro-Textured Heat-Transferring Sheets
1Surface Engieering Design Laboratory, SIT, Japan
2Ebina Denka-Kogyo, Co., Ltd., Japan
ABSTRACT
Enhancement of convection and radiation heat transfer processes was essential to prevent the semi-conductor chips and the power transistors from thermal damages and deterioration. A micro-textured copper sheet with Fe Ni acicular unit cells was fabricated by the wet plating process. The heat transfer experiments under the forced air cooling were utilized to investigate the thermal transients on the copper sheets with and without micro-textures by using the thermography. The air flow velocity was varied to describe the cooling capacity of micro-textured copper sheet. The unit cell size and aspect ratio of Fe Ni acicular micro-textures were varied to investigate their effect on the radiation and convection heat transfer processes.
Keywords: Micro-textured copper sheet, Fe Ni acicular unit cells, Heat transfer, Convection, Air forced cooling, Radiation, Thermography, Thermal transients
1Surface Engieering Design Laboratory, SIT, Japan
2Ebina Denka-Kogyo, Co., Ltd., Japan
ABSTRACT
Enhancement of convection and radiation heat transfer processes was essential to prevent the semi-conductor chips and the power transistors from thermal damages and deterioration. A micro-textured copper sheet with Fe Ni acicular unit cells was fabricated by the wet plating process. The heat transfer experiments under the forced air cooling were utilized to investigate the thermal transients on the copper sheets with and without micro-textures by using the thermography. The air flow velocity was varied to describe the cooling capacity of micro-textured copper sheet. The unit cell size and aspect ratio of Fe Ni acicular micro-textures were varied to investigate their effect on the radiation and convection heat transfer processes.
Keywords: Micro-textured copper sheet, Fe Ni acicular unit cells, Heat transfer, Convection, Air forced cooling, Radiation, Thermography, Thermal transients