Proceedings of the
World Congress on Micro and Nano Manufacturing (WCMNM 2022 )
19–22 September 2022, Lueven, Belgium
doi:10.3850/978-981-18-5180-3_RP45-0052

The Process Parameters of Micro Particle Bombarding (MPB) for Surface Integrity Enhancement of Cermet Material

Fu-Chuan Hsu1, Li-Jie Chen2, Zong-Rong Liu1, Hsiu-An Tsai1, Chin-Hao Lin1, Chia-Hung Huang1, Tsung-Jen Cheng3, Hwa-Teng Lee2 and Chiu-Feng Lin1

1Metal Industries Research and Development Centre (MIRDC), Kaohsiung 81160,Taiwan

2National Cheng Kung University, Department of Mechanical Engineering, Tainan 70101, Taiwan

3Power Micro International Co., Limited, Kaohsiung 83051, Taiwan

ABSTRACT

Micro particle bombarding (MPB) provides two functions, one is micro blasting for cleaning purpose and the other one is. micro peening for surface strengthening. The surface roughness, micro hardness and residual stress after micro particle bombarding is measured by 3D laser confocal microscope and Bruker D8 X-ray diffractometer. The regression relationship between particle bombarding time and micro hardness is established to predict the surface hardness after MPB process. The experimental results reveal that the surface hardness of cermet is increased 14%~66% (HV2167~HV3163) by micro particle bombarding. The micro peening process provides a good surface integrity due to better surface roughness of 0.1µmRa and higher compress residual stress of -1393.7 MPa, which is up to 26% enhancement compared to base material.

Keywords: Micro Particle Bombarding (MPB), Micro Blasting, Micro Peening, Cermet.



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