Proceedings of the
World Congress on Micro and Nano Manufacturing (WCMNM 2022 )
19–22 September 2022, Lueven, Belgium
doi:10.3850/978-981-18-5180-3_RP44-0040

Adhesion Improvement of the Electroless Film Deposited on Glass by the Ultrasonic Micromachining Process

Harsh Pandey, Karan Pawar and Pradeep Dixit

Electrochemical Microfabrication Laboratory, Department of Mechanical Engineering, Indian Institute of Technology Bombay, Mumbai 400076, India

ABSTRACT

The application of ultrasonic machining to create localized roughness on the glass material is presented. This mechanical-roughened surface resulted in an improved adhesion when electroless nickel was deposited. Manual tape-adhesion tests were conducted to qualify the adhesion between the electroless nickel and the glass substrate. The critical parameters, such as abrasive size, ultrasonic power ratings, and feed rate, were varied to create distinct roughness. The surface roughness increased when larger abrasive particles were used at higher power ratings and lower feed rates. Adhesion was drastically improved in those regions which were roughened. SEM cross-section revealed that the electroless nickel deposited atoms were locked in the valleys formed by the abrasives, which resulted in improved adhesion.

Keywords: Ultrasonic, Electroless, Adhesion, Abrasive.



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