Proceedings of the
9th International Conference of Nanomanufacturing (nanoMan2024)
December 1 – 4, 2024, Singapore
Effects of Grain Size on Removal Mechanism of Brittle Polycrystalline Materials in Laser Assisted Diamond Turning
School of Mechanical and Electrical Engineering, University of Electronic Science and Technology of China, Chengdu, China.
ABSTRACT
The nano-cutting performance of brittle polycrystalline materials is greatly influenced by their grain size. In the present work, a finite element model of laser assisted diamond turning of polycrystalline tungsten carbide (WC) was developed, aiming to evaluate the influence of grain size on the material deformation and removal mechanism in laser assisted diamond turning. The thermal effect of laser in-situ radiation on the workpiece is implemented in a user subroutine. The simulation results show that the grain boundary density and intergranular bonding strength decrease significantly with the increase of grain size. Therefore, cutting energy cannot be absorbed through material plastic deformation and tends to be released through intergranular fractures, causing grain spalling on the machined surface. Thermal softening effect of laser can reduce the grain spalling by reducing the grain strength, but it cannot be avoided, thereby compromising the finish surface integrity inevitably.
Keywords: Machining mechanism, Laser assisted turning, Grain size, Numerical simulation.
