Proceedings of the
9th International Conference of Nanomanufacturing (nanoMan2024)
December 1 – 4, 2024, Singapore
An Experimental Investigation on High-Precision and Damage-Free Processing of Diamond
State Key Laboratory of Ultra-precision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hong Kong, China.
ABSTRACT
Diamond is honored as the reputation of "ultimate semiconductor material" and the surface with high-precision and damage-free is required for diamond to get the most out of its numerous excellent properties. Chemical mechanical polishing (CMP) is the primary approach to achieve the surface with high-precision and damage-free. However, it is difficult for diamond to be removed and oxidized on account of its properties of large hardness and stable chemical inertness. Herein, the effects of polishing parameters on the surface morphology were investigated by orthogonal experiments. The experiment results indicated that the polishing pressure and the abrasive type are the most significant parameters that determined the surface morphology of diamond. The stronger mechanical force will induce the appearance of pits and scratch on the diamond surface after polishing. However, hydroxyl radicals(•OH) has a favorable promoting effect on improving surface quality of diamond. The surface with high-precision and damage-free can be obtained under the strong mechanical action and •OH. This works sheds lights on the polishing technology for obtaining the diamond with high-precision and damage-free surface.
Keywords: CMP, Diamond, Ultra-precision machining, Hard and brittle materials.
