Impact of Thermo-Mechanical Effects to the Measurement Behavior of a Molded SO16 System-In-Package Current Sensor Investigated by a Physics-Based Design for Reliability (DfR) Approach

In this work a physics-based design for reliability approach (DfR) is presented investigating the thermo-mechanical behavior of a AMR current measurement sensor device in a SOIC16 package. Due to the exposition to different thermal loads during production and operation the intrinsic strain values at the internal sensor cells are changing. This is suspected for a significant impact to the stress/strains at the AMR sensor cells and possibly affecting the measurement accuracy. For investigating the impact from different influences and uncertainties several simulationbased design-of-experiment (DoE) studies were performed. Beside the incorporation of effects from the material behavior, also process related parameters and tolerances were included in the virtual model. The modelling of stiffening effects caused by mold compound ageing at the outer layers during operation was also included. The generated design for reliability "environment" represents a comprehensive approach to combine production process and operation to examine possible thermo-mechanical effects during an early development stage.

Keywords: Design for reliability, Sensitivity study, Uncertainty quantification, Design-of-Experiments, Current sensor, System-in-Package, Thermo-mechanical effects.

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