Proceedings of the
9th International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN2022)
15 – 18 November 2022, Singapore

Cutting of Monocrystalline Diamond Tools Using Short Pulse UV Laser

Kakeru Koiso1, Akinori Yui1,a, Hirofumi Suzuki2 and Toshiyuki Morizumi3

1Department of Mechanical Engineering, KANAGAWA University, 3-27-1 Rokkakubashi, Kanagawa-ku, Yokohama, 221-8686, Japan

2Department of Mechanical Engineering, Chubu University, 1200, Matsumoto-cho, Kasugai, Aichi, 487-8501, Japan

3JONAN DIAMONDO Industry Co., LTD, 7-4-6, Hiyoshi, Kohoku-ku, Yokohama, 223-0061, Japan


Diamond tools are indispensable for the precision machining of hard and brittle materials, whose industrial demand has been increasing in recent years. Generally, diamond tools are formed by skilled workers lapping with fine diamond abrasive grains. In this case, the lapping process is time consuming and the removed diamond chips cannot be used. High-purity IIa type diamonds transmit laser light and cannot be laser processed, whereas Ib type diamonds that contain a small number of impurities can be laser processed. In this study, Ib diamond was cut using a short wavelength UV laser, and the surface texture and processing efficiency of the processed surface were evaluated. We successfully achieved high quality and high efficiency cutting by the shift plunge cutting method using the newly developed UV laser. Moreover, this method allows the use of laser-cut diamond fragments as a tool.

Keywords: Cutting, UV laser, Monocrystalline diamond, Surface integrity, Cutting efficiency

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