Proceedings of the
9th International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN2022)
15 – 18 November 2022, Singapore

Aspheric Cutting of CVD-SiC Molds by PCD milling tool

Mirai Sakaida1, Tatsuya Furuki1, Hirofumi Suzuki1,a and Tatsuya Fukuda2

1Department of Mechanical Engineering, Chubu University, 1200 Matsumoto, Kasugai, Aichi, 487-8501, Japan

2Tokai Engineering Service, 1-17-23, Nakamura, Nagoya, Aichi, 450-0003, Japan


Demands of large molded components with many types of structured surface are increasing in optical device and medical device. Furthermore, structured molds of harder ceramics are required to decrease the mold wear and increase a number of molding times. In order to machine large structured molds of CVD-SiC, large milling tools made of polycrystalline diamond (PCD) were developed. Three hundred cutting edges were generated sharply and precisely by wire EDM and grinding on the edge of a PCD wafer. In the fundamental cutting tests of three types of CVD-SiC with different grain sizes, micro grooves were machined by the developed PCD milling tool, and aspheric cutting tests were carried out. From the experimental results, it was clarified that the developed PCD milling tool was useful for high-efficiency and ultra-precision cutting of CVD-SiC.

Keywords: Polycrystalline diamond tool, CVD-SiC, Precision cutting, Milling, Wire EDM, Cutting force

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