Proceedings of the
9th International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN2022)
15 – 18 November 2022, Singapore

A Preliminary Study of Subsurface Damage in Grinding of Reaction-bonded SiC

Sai Guo1,2,a, Chi Fai Cheung1, Lai Ting Ho1 and Bi Zhang2

1State Key Laboratory of Ultraprecision Machining Technology, Department of Industrial and Systems Engineering,The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong, China

2Department of Mechanical and Energy Engineering, Southern University of Science and Technology, Shenzhen, 518055, China


Poor surface integrity is usually induced in conventional machining of reaction-bonded SiC (RB-SiC) due to its extremely high hardness and low fracture toughness. With the increasing demand for a high degree of accuracy and high-resolution optical systems, there are growing demands for high surface integrity of machined RB-SiC components. Although extensive studies have investigated the surface generation and surface morphology in ultra-precision grinding (UPG) of RB-SiC, few of them focus on the alteration of workpiece subsurface damage (SSD) during grinding at various conditions. In this study, UPG and conventional surface grinding (SG) of RB-SiC were carried out to investigate the variation of workpiece surface integrity. The results reveal that the surfaces ground in UPG and SG are both characterized with typical brittle fracture features such as grinding scratches and surface pits. The SSD generated in different grinding conditions is revealed with the similar results that the major SSD features are laterally spread cracks which are mostly confined in the superficial layer below the ground surfaces. This preliminary study on SSD of RB-SiC workpieces ground in various conditions deepens the understanding of SSD features and spatial distribution below the ground surface.

Keywords: Subsurface damage, Surface morphology, Cracks, Reaction-bonded SiC, Ultra-precision grinding

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