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<title-group><doi>123</doi>
<article-title>Machining Effect of Vibration Electrochemical Polishing (VECP)</article-title>
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<author>Uk Su Kim<sup>1</sup>, Sun Ho Kim<sup>2</sup> and Jeong Woo Park<sup>3</sup>  </author>

<aff><sup>1</sup>Department of Advanced Parts and Materials Engineering, Chosun University, Korea. </aff>

<email><a href="mailto:uksunano@gmail.com  ">uksunano@gmail.com  </a></email>

<aff><sup>2</sup>National Center for Nanoprocess and Equipments, Korea Institute of Indurstrial Technology, Korea. </aff>

<email><a href="mailto:sunho5713@kitech.re.kr  ">sunho5713@kitech.re.kr  </a></email>

<aff><sup>3</sup>Department of Mechanical System Engineering, Chosun University, Korea. </aff>

<email><a href="mailto:jwoopark@chosun.ac.kr ">jwoopark@chosun.ac.kr </a></email>

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<title>ABSTRACT</title>
<p>Electrochemical polishing (ECP) has contributed in many areas. However, in conventional ECP, impurities in the material or outside influences may leave micropits in the surface during machining. These micropit surface defects degrade the quality and durability of the machined surface. Recently, much attention has focused on vibration electrochemical polishing (VECP) in an attempt to improve surface quality. However, the material removal rate (MRR) has yet to be verified for VECP. In this study, we examined and compared the MRR and material removal properties of ECP and VECP, using current density measurements. The machined surface was measured using surface profiling software. Our results indicated a significant improvement in the amount of material removed with VECP, compared with ECP.  </p><p><italic>Keywords: </italic>Electrochemical polishing, Hybrid process, Ultrasonic vibration, Material removal rate. </p>
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