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<title-group><doi>113</doi>
<article-title>Distributed Plasma Nitriding Systems for Surface Treatment of Miniature Functional Products</article-title>
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<author>Tatsuhiko Aizawa<sup>1</sup> and Yoshio Sugita<sup>2</sup>  </author>

<aff><sup>1</sup>Department of Engineering and Design, Shibaura Institute of Technology  </aff>
<aff><sup>2</sup>YS-Electric Industry, Co. Ltd., Yamanashi Univeristy </aff>

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<title>ABSTRACT</title>
<p>RF-DC plasma nitriding system has been developed as an alternative surface treatment. Through comparison of its nitriding performance for SKD-61 tool steels with the commercial plasma processes, the highest hardness depth profile was attained: e.g. the surface hardness  &gt;  1200 Hv and the nitrided thickness  &gt;  60 &#x00B5;m were attained after nitriding for 14.4 ks at 753 K. In the present papers, two distributed plasma nitriding systems were developed to propose a miniature surface treatment for manufacturing on the basis of this RF-DC plasma nitriding. The distributed multi-reactor system stood on the down-sized unit to make plasma nitriding in the parallel manner together with improvement of nitriding performance; e.g. the same nitriding performance for 14.4 ks in the above was fulfilled only for 7.2 ks. This down-sizing significantly reduced the total leading time in batch. The distributed multi-device system stood on the hollow cathode device working in the large-scaled nitriding chamber. Higher hardness and deeper nitrided layer thickness were obtained even by low temperature plasma nitriding for shorter duration; e.g. the surface hardness  &gt;  1400 Hv, the nitrided thickness  &gt;  40 &#x00B5;m and the higher nitrogen content  &gt;  4 mass% were put into practice by nitriding only at 693 K. Channels and holes in the micro-tube and micro-nozzles worked as a hollow cathode device; inner surface and holes of micro-parts were nitrided to have sufficient hardness.  </p><p><italic>Keywords: </italic>Miniature plasma nitriding, Distributed system, Down-sizing, Reactor unit, Leading time in batch, Hollow cathode nitriding device, Low temperature nitriding, High hardness, Deep nitrided layer thickness. </p>
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