Numerical estimation of residual stress developed in glass products during its production process is necessary for its product quality improvement. Cooling stage of production process is the key stage for development of residual stress in glass products. Heat transfer mechanisms involved during this stage is complex. Hence, in FE simulation of the glass manufacturing process, thermal boundary conditions becomes one of the major unknown parameter that dictates the residual stress level developed in glass. In this paper, selection of FE modeling approach (2D or 3D) is demonstrated for a thermal cycling process of P-SK57^™ glass disc by observing at photoelastic experimental results. A hybrid approach, coupled experimental and numerical approach, is used to estimate the unknown contact conductance boundary condition in FE simulation. Integrated residual birefringence distribution obtained from photoelastic experiments is compared with integrated birefringence distribution computed from FE results until they match for estimation of thermal boundary conditions.

Keywords: Residual stress, Finite element method, Glass, Digital photoelasticity.