Process Chains


Session TitleProcess Chains

Development of Metal MEMS Manufacturing Technologies Using Pierced Metal Foil and Diffusion Bonding Process at Low Temperature
Tomomi Shiratori, Shizuka Nakano, Masahito Katoh, Yohei Suzuki, Takuya Aihara and Ming Yang

Effect of Residual Stress on the Distortion of Microembossed Metal Inserts for Assembly Injection Moulding
Philipp Frey, Christoph Höhler and Marion Merklein

Post-Treatment Process of Additive Manufacturing for Intramedullary Nails by Ultrasonic Vibration Machining, Abrasive Flow Machining, and Electropolishing Technology
Fu-Chuan Hsu, Tsung-Pin Hung, Yunn-Shiuan Liao, Shih-Ming Wang, Ming-Chyuan Lu, Ying-Cheng Lu and Ho-Chung Fu