doi: 10.3850/978-981-11-0749-8_KN3
Nanoimprint Lithography: The (planar) World is Not Enough
Helmut Schift
Paul Scherrer Institut, 5232 Villigen PSI, Switzerland
Abstract
The need to integrate functionalities in micro- and nanodevices is often satisfied by addition of new process steps to existing process chains, which enhances complexity in vertical direction of a device without breaking the boundary conditions of planar lithographic techniques. Modern patterning based on replication is now investigating 3D techniques because they often enable to integrate these functionalities in new, often much simpler ways. They deviate from the established concepts; however, the transition from 2D to 3D is often gradual. This contribution describes a selection of these “2D to 3D” and “more than 2D” concepts, which have the potential to become an integral part of any process development in future manufacturing of micro- and nanodevices.
Keywords: Molding, nanoimprint lithography, anisotropic patterning, pattern transfer, 3D topography
