doi: 10.3850/978-981-11-0749-8_731
Strategies for Micro-Handling of Solder Balls for the Automated Reballing of BGA Packages
Gianmauro Fontana1, Serena Ruggeri1, Irene Fassi1 and Giovanni Legnani2
1Institute of Industrial Technologies and Automation, CNR, Italy
2University of Brescia, Italy
Abstract
Recently, the remanufacturing of electronic products has become of great interest for both the industrial and research fields, for the several benefits deriving from the recovery of high added value elements at their end of life. In particular, the reballing of BGA (Ball Grid Array) packages is an important process in the rework of PCBs (Printed Circuit Boards). In this context, this paper presents two methods for the automated reballing and the corresponding tools able to operate different solder spheres. The tasks implemented for the reballing of a target BGA matrix will be described and discussed to underline their characteristics and applicability.
Keywords: BGA reballing, Reballing device, Solder ball, Automated rework, Pick-and-place, Store-and-place.
