doi: 10.3850/978-981-11-0749-8_690
A Thinner Technology from Thick to Thin Films Microprocessing of Microelectronics Hybrids Circuitry by Laser Precision Trimming
D. Ulieru, Oana Maria Ulieru, A. Topor and Xavi Vila
SITEX 45 SRL, Bucharest, Romania
sitex45@gmail.com
Abstract
The microelectronics development with new fields of applications likemicrosystems, sensors and multichip modules needs the permanent increasing of miniaturization and the complexity at the chip level. It is looking too for high precision, relatively cheap and small series of production technologies. A modern cheaper design concept and novelty, manufacturing process will be shown on the paper. The paper deals with the design of the process, the topology design of different types of products on thin films basis. The laser processing the metallic thin films drawn on a glass substrate. By using laser trimming technology which could be fully automated, the standard processing technologies like photo-lithography, mask and etching are not need to be used any more.
Keywords: Thin films, Microsystems, Sensors, Laser precision trimming.
