doi: 10.3850/978-981-11-0749-8_688
Injection Moulding and Selective Metallisation Technologies for Polymer Microsystems
S. Dessors1, L. Tenchine1, S. Gout1, S. Azcarate2, G. Tosello3, M. Calaon3, N. Miller4,
B. Brown4, C. Edouard5, T. Müller6, W. Wittner7, M. Prantl8, Xiaobang Shang9 and Afif Batal9
1IPC, 2 rue Pierre et Marie Curie, 01100 Bellignat, France
2Tekniker, Technological Subdirection, Scientific Director, Iñaki Goenaga 5, 20600 Eibar, Spain
3Technical University of Denmark, Department of Manufacturing Engineering, 2800 Kgs. Lyngby, Denmark
4Flann Microwave Ltd, Dunmere road, Bodmin, Cornwall, United Kingdom
5Flowdit, 2 rue Paul Milleret, 25000 Besançon, France
6KIT Karlsruhe Institute of Technology, 76344 Eggenstein-Leopoldshafen, Germany
7Ernst Wittner GmbH, Missindorfstrasse 21, 1140 Vienna, Austria
8Alicona Imaging GmbH, Optical 3D measurement and inspection, Dr Auner Strasse, 8074 Raaba/Graz, Austria
9School of Mechanical Engineering, University of Birmingham, Birmingham, United Kingdom
Abstract
The present paper describes how developing and optimizing high-throughput integrated technologies for the production of miniaturised multi-material and multi-functional components at industrial scale. Based on 2 industrial demonstrators (a band diplexer and a micro aeraulic device), the paper shows that many technologies have to be combined to succeed: injection moulding process, copper plating, laser ablation, laser welding, glue welding
Keywords: Microsystem, Plating, LDS, MEMS, Injection moulding, Laser.
