doi: 10.3850/978-981-11-0749-8_682
Development of Metal MEMS Manufacturing Technologies Using Pierced Metal Foil and Diffusion Bonding Process at Low Temperature
Tomomi Shiratori1, Shizuka Nakano2, Masahito Katoh2, Yohei Suzuki1, Takuya Aihara1 and Ming Yang3
1Komatsuseiki Kosakusho Co., LTD., Japan
2National Institute of Advanced Industrial Science and Technology, Japan
3Graduate school of system design, Tokyo Metroporitan University, Japan
Abstract
Silicon process has been adopted in general MEMS (Micro Electro Mechanical Systems) manufacturing process. The other MEMS manufacturing processes, such as polymer molding, metal forming and so on that have been expected to biomedical and energy fields. In this study, authors developed new technologies of metal-MEMS manufacturing and applied them to the production of a metal micro-pump. The production system includes a rolling technology for fine-grained stainless steel, a piercing process with nano-metric adjustable dies, and lowtemperature diffusion bonding technology which uses full-martensitic SUS304. The combination of these new technologies can meet the demand for mass production. As a conclusion, this production system achieved the nano-metric accuracy of pump-parts features and the parts bonding due to fine-grains of full-martensitic SUS304. Therefore, the developed micro pump realized higher performance than conventional pump.
Keywords: Punching, Piercing, Diffusion bonding, Fine-grained, Stainless steel.
