doi: 10.3850/978-981-11-0749-8_678
Investigations on Flexural Fatigue Strength of Conductor Paths Fabricated by LPKF-LDS® Technology
H. Mueller1, T. Groezinger1, M. Ketata2, S. Weser1, W. Eberhardt1 and A. Zimmermann 1,2
1Hahn-Schickard, Stuttgart, Germany
2University of Stuttgart, Institute for Micro Integration IFM, Germany
Abstract
Reliability aspects are crucial for the success of every technology in industrial application. Regarding interconnect devices, several methods are applied to evaluate reliability of conductor paths like accelerated environmental tests. Especially Moulded Interconnect Devices (MID) which enable versatile applications with 3D circuitry on 3D shaped injection moulded thermoplastic parts are often under particular stress, e.g. as component of a housing. In this paper a new test method for evaluating the flexural fatigue strength of conductor paths produced by the laser based LPKF-LDS® technology is presented.
Keywords: Moulded Interconnect Devices, MID, LPKF-LDS®, Flexural fatigue strength, Nickel-free metal layer systems.
