Moulded Interconnect Devices (MID) enable versatile applications with 3D circuitry on 3D shaped injection moulded thermoplastic parts. Especially laser based patterning technology combined with selective metallization shows high capability for various miniaturized applications. With a minimized spot size, the laser system in the so-called LPKF-LDS® process is a fine patterning tool and is very flexible concerning the 3D circuitry by simple adapting the laser processing parameters. In this paper a new process for fine pitch metal deposition on a new liquid crystal polymer material for Laser Direct Structuring (LDS LCP) is described.